Future cooling: copper-diamond alloy?

Researchers at Fraunhofer-Forscher have developed a new material which allows better cooling than the conventional copper and aluminum solutions. To achieve this result, diamond powder has been added to metallic copper. Diamond conducts heat five times better than copper.

Almost all current coolers are based on aluminum and copper

The result is a compound with 1.5 times the heat conduction of copper. Another advantage is that the material does not expand too much when heated, otherwise it couldn't be used in electronic devices.

As of yet, the material is only being demonstrated, whereas in the future it may find its way into notebooks, where heat dissipation has always been a problem. 

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