New Nehalem LGA1366 socket is stronger

The Inquirer has published a few images of a testboard with the new LGA1366 socket and by the looks of it, Intel has done it's best to reinforce the processor's attachment as much as they could. An iron backplate on the backplate of the motherboard will be standard, thus improving the way the weight of heavy CPU coolers is spread throughout the board. To attach the cooler you still have to use the four holes around the socket though, causing the push-pin attachment to return with Nehalem.

Due to the Quickpath connection and the triple-channel DDR3 memorycontroller, the Nehalem processor has grown larger and, as seen on the slide below, has almost 600 extra contactpoints compared to the Core 2 generation. The current socket 775 has a size of 58x61mm, the socket with 1366 pins will be 60x82mm, indicating that this socket is incompatible with the current processorcoolers. This will allow for the manufacturers to come up with interesting new models by the end of this year.

Tags: ddr3 nehalem quickpath socket-1366 core2

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