Intel announced design completion first mobile WiMAX baseband chip

Intel announced design completion of its first mobile WiMAX baseband chip. Combined with the company's previously announced single-chip, multi-band WiMAX/Wi-Fi radio, the pair creates a complete chipset called the Intel WiMAX Connection 2300. This development marks another step in Intel's efforts to deliver an "always best connected" mobile Internet experience for future laptops and mobile devices.

The Intel WiMAX Connection 2300 chipset design was demonstrated during Executive Vice President and Chief Sales and Marketing Officer Sean Maloney's keynote at the 3G World Congress and Mobility Marketplace in Hong Kong.

Maloney showed an Intel Centrino Duo mobile technology-based laptop with mobile WiMAX (IEEE 802.16e-2005), Wi-Fi (IEEE 802.11n), and high-speed downlink packet access (HSDPA) 3G capabilities successfully accessing the Internet at broadband speeds over a mobile WiMAX network. The demonstration illustrates the high-speed and quality of service capability of WiMAX for handling content-rich applications that can be extremely responsive without interference from other wireless technologies residing on the same system.

With the initial Intel WiMAX Connection 2300 chipset design now complete, Intel plans to focus on validating and testing the product, with plans to sample both card and module forms beginning in late 2007.