Dear visitor, it would appear you are using Internet Explorer 6 as a browser. Unfortunately Hardware.Info is rendered less than completely accurately in this by now obsolete browser. For an optimal experience of our site, we recommend you use an up-to-date version of Mozilla Firefox, Microsoft Internet Explorer, Google Chrome, Apple Safari or Opera.

Toshiba to offer 14.6MP CMOS sensor packs with back-side illumination

hwi-h  News » External news » TechConnect » Toshiba to offer 14.6MP CMOS sensor packs with back-side illumination

External news

Toshiba to offer 14.6MP CMOS sensor packs with back-side illumination

TechConnect

Site: TechConnect

Publication date: 10/27/2009 11:31 AM

Toshiba Corp. has just revealed a fresh and really funky CMOS image sensor for digital cameras and mobile phones that 'packs' 14.6 million pixels and features back-side illumination technology (BSI). The use of BSI means that the lenses are deployed on the rear of the sensor on the silicon substrate, not on the front, where wiring limits light absorption. According to Toshiba this positioning boosts light sensitivity and absorption by 40% compared to existing products, and allows the formation of finer image pixels. The new BSI-enhanced sensor will start being sampled in December but will only enter mass production in Q3 2010. It will be made on 65nm technology at Toshiba's Oita Operations.

Read more...

Tags Tags: cmos

No comments.

Hardware.Info in other countries: België - Nederland - United Kingdom - United States